CUSTOM PACKAGING

• Ruggedized enclosures
• High density harnessing
• Design for thermal, shock, vibration, maintainability, EMI, human factors
• Military and DOD Design Specifications

    ATE INTERFACE HARDWARE

• Interface adapters using COTS Interface Modules
• VME/VXI I/O panels and harnessing
• Signal conditioning, holding fixtures

    PRINTED CIRCUIT DESIGN

• Controlled Impedance
• Multi-layer
• Thru hole and surface mount technologies